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| • Body Sizes: 7 x 7mm to 28 x 28mm • Package Height: 1.4mm • Lead Counts: 32L to 208L • Lead Pitch: 0.80mm to 0.40mm • Wide range of open tool leadframe and die pad sizes available • Moisture Sensitivity: JEDEC Level 3 • JEDEC standard compliant • Lead-free and Green materials sets available • Copper and alloy leadframes availabl |
STATS ChipPAC’s LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications. |
| • 3D Graphics • Multimedia • PC Chipsets • Video / Audio • Telecom • Disc Drives • Communication Boards (Ethernet, ISDN) |
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| 厂家 | STATSCHIP [STATS ChipPAC, Ltd.] |
| 简要 描述 |
Low Profile Quad Flat Pack |
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| 413SR10 |
| ka2184 |
| 2N681 |
| CW431CS |
| MSA-1105 |
| SST25VF020-20-4C-SAE |
| LC74735NW |
| TLE5216G |
